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POSTECH ICMELaboratory

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Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films
Author
J. Yu*, K. Kim
Journal
Metallurgical and Materials Transactions A
Vol
46
Page
3173 (2015)
Year
File
Effects of under bump metallurgy UBM materials on the corrosion of electroless nickel films.pdf (1.8M) 16회 다운로드 DATE : 2024-10-16 12:22:09
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